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Brand Name : HSTECH
Model Number : HS-620
Certification : CE
Place of Origin : China
MOQ : 1 set
Price : Negotiable
Payment Terms : T/T, Western Union, MoneyGram
Supply Ability : 100 sets per month
Delivery Time : 7~9 work days
Packaging Details : Wooden package
Product Name : BGA Rework Station
Warranty : 1 Year
Control : Touch Screen
Optoelectronic Switch : OMRON
Material : Aluminum Alloy
Condition : New
Thickness : 0.3 - 5mm
Power Supply : AC220V
Air Pressure : 4-6bar
Weight : 30KG
MCGS Touch Screen Control Manual & Automatic Laser Position BGA Rework Station
Introduction
A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging to repair when defects occur.
Features:
1.Automatic&Manual operation system.
2. 5 million CCD camera optical alignment system mount precision:±0.01mm.
3.MCGS touch screen control.
4.Laser position.
5.Repair success rate 99.99%.
Specification:
| BGA Rework Station | Model:HS-620 | 
| Power Supply | AC 220V±10% 50/60Hz | 
| Total power | 3500W | 
| Heater power | Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W | 
| Electric material | Driving motor+PLC smart temp.controller+color touch screen | 
| Temperature | control independent temp.controller,the precision can reach ±1℃ | 
| Temperature Interface | 1pcs | 
| Locating way | V shape slot,PCB support jigs can adjust,laser light do fast centering and position | 
| Overall dimension | L650mm*W630mm*H850mm | 
| PCB size | Max 450mm*390mm Min 10mm*10mm | 
| BGA size | Max 80mm*80mm Min 1mm*1mm | 
| Weight of machine | 60KG | 
| Usage Repair | chips / phone motherboard etc | 
Applications
BGA Component Replacement:
Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
Solder Joint Repair:
Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
Prototyping:
Useful in prototyping environments where BGA components need to be frequently replaced or modified.
Quality Control:
Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.
Benefits
Increased Reliability:
Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
Cost-Effective Repairs:
Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
Enhanced Precision:
Provides precise temperature control and alignment for high-quality rework results.
Time Efficiency:
Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
Flexibility:
Can handle various sizes and types of BGA components, making them versatile for different applications.


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| MCGS Touch Screen Control BGA Rework Station Manual & Automatic Laser Position Images | 
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